Preliminary results show significant physical distortion of the optical component, which could cause optical misalignments and additional coupling losses. A stress-strain analysis is also performed. Temperature profiles along the MZ modulator reveal a strong non-uniformity, reaching a 26C temperature difference between the optical component input and output. Integrated system shows elevated temperatures in the optical component caused by the heat generated in the power amplifier and dissipated into the substrate-carrier and from there into the LTCC. All module connections such as voltage supply, RF signals and fiber optic input/output are realized through the LTCC. This paper presents a thermo-mechanical analysis of an optoelectronic system including a Mach-Zehnder optical modulator integrated with a broad-band GaAs driver amplifier, forming a module which then is placed into a low temperature co-fired ceramic (LTCC) substrate.
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